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Variants
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Grain: Silicon carbide, highly effective chip removal
Bond: Resin bond
Backing material: SGY: Tough polyester fabric
SPE backing material: E-paper
Diameter of the abrasive discs:
- 375 mm = dia. 40 mm centre hole
- 406 mm = dia. 25 mm centre hole
For use on wood, concrete and screed floors
For use on coarse-grained screeds
Special grinding of sintered layers on anhydrous screeds
Levelling protruding components on screeds
Removing adhesive residue from carpets
Select RAL-colour code
!! NOTE: On-screen visualisation of the colour differs from real colour shade!!
